Vacuum laminating process

Details Vacuum laminating process Vacuum laminating process

1977-02-09

1978-11-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

96 351, 156235, 156238, 156247, 156285, 156634, 156656, 156659, 156902, 427 96, C23F 102

Patent

active

041274369

ABSTRACT:
A process is described for applying, under vacuum, a photoresist-forming layer to a surface, such as a printed circuit board, whereby a laminate without entrapped air bubbles is obtained. The surface to which the photoresist-forming layer is applied has raised areas, such as circuit lines, which are completely enveloped by the layer.

REFERENCES:
patent: 3395014 (1968-07-01), Cohen et al.
patent: 3629036 (1971-12-01), Isaacson

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