Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1977-02-09
1978-11-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
96 351, 156235, 156238, 156247, 156285, 156634, 156656, 156659, 156902, 427 96, C23F 102
Patent
active
041274369
ABSTRACT:
A process is described for applying, under vacuum, a photoresist-forming layer to a surface, such as a printed circuit board, whereby a laminate without entrapped air bubbles is obtained. The surface to which the photoresist-forming layer is applied has raised areas, such as circuit lines, which are completely enveloped by the layer.
REFERENCES:
patent: 3395014 (1968-07-01), Cohen et al.
patent: 3629036 (1971-12-01), Isaacson
E. I. Du Pont de Nemours and Company
Powell William A.
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