Vacuum-film-forming apparatus and method

Details Vacuum-film-forming apparatus and method Vacuum-film-forming apparatus and method

1989-08-11

1990-10-30

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

118724, 118725, 20429809, C23C 1434

Patent

active

049666690

ABSTRACT:
The interior of a chamber within which a target assembly is disposed is evacuated to remove residual impurity gases while heated water flows within the target assembly. When the internal pressure within the chamber drops belows a predetermined level, cooled water flows within the target assembly, and a film is formed on a semiconductor substrate placed within the chamber as the target assembly is being cooled by the cooled water. Gases contained in the ambient atmosphere around the chamber are prevented from being introduced into the chamber when the interior of the chamber is opened. It is also possible to prevent any condensation of vapor on the target assembly.

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