Vacuum die bond for known good die assembly

Details Vacuum die bond for known good die assembly Vacuum die bond for known good die assembly

1996-05-21

1999-02-23

Niebling, John

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

435 14, 435 15, H01L 2166

Patent

active

058743197

ABSTRACT:
Method for testing bare semiconductor die which includes providing a test substrate with a die receiving surface and bond pads with conductive traces which extend away from the surface and are connected to leads that may be contacted with test probes. A vacuum source is applied to an aperture in the die receiving surface. Atmospheric pressure holds the die in place during the connection of thin wires. After connection, the die is held in place during testing by the thin wires.

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