Vacuum compatible water vapor and rinse process module

Details Vacuum compatible water vapor and rinse process module Vacuum compatible water vapor and rinse process module

1996-01-16

1998-10-13

Scheiner, Laurie

Cleaning and liquid contact with solids

Processes

Including use of vacuum, suction, or inert atmosphere

134 23, 134 30, 134 54, 156345, 156625, 156646, 156657, 20419237, 20429825, 20429833, 414217, 437225, B08B 504

Patent

active

058206922

ABSTRACT:
A process module which can be integrated with a reduced pressure cluster tool system for semiconductor wafer processing to perform ambient or near ambient pressure reactions without requiring an intermediate buffer chamber. The process module includes:

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Product Brochure: "Excalibur.RTM. Vapor Chase Clening Syustems;" FSI International, Inc. (Aug. 1994).
Werkhoven et al, "Cluster-Tool Integrated HF Vapor Etching for Native Oxide Free Processing;" Mat. Res. Soc. Symp. Proc., vol. 315, pp. 211-217 (1993),
Werkhoven et l, "Contamination Control of Polysilicon Gates In A Vertical Reactor Cluster lTool;" Journal of the IES, May-Jun. 1993, pp. 33-36.
Product Brochure: Primax.TM. Gas Phase Cleaning Module; SubMicron Systems, Inc. (not dated).
Izumi et al; "A New Cleaning Method By Using Anhydrous HF/CH.sub.3 OH Vapor System;" The Electro Chemical Society Inc.; vol. 92-12; pp. 260-266.
Product Brochre for Advantage 2000; Genus Inc.; 4 pgs; Jan. 4, 1994.

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