Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate
2007-06-07
2009-11-24
Chen, Bret (Department: 1792)
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
C427S558000, C427S579000, C438S308000, C438S788000
Reexamination Certificate
active
07622162
ABSTRACT:
Using UV radiation, methods to modify shallow trench isolation (STI) film tensile stress to generate channel strain without adversely impacting the efficiency of the transistor fabrication process are disclosed. Methods involve a two phase process: a deposition phase, wherein silanol groups are formed in the silicon dioxide film, and a bond reconstruction phase, wherein UV radiation removes silanol bonds and induce tensile stress in the silicon dioxide film.
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Cho Seon-Mee
Schravendijk Bart van
Chen Bret
Novellus Systems Inc.
Weaver Austin Villeneuve & Sampson LLP
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