Utilizing controlled illumination for creating or removing a con

Details Utilizing controlled illumination for creating or removing a con Utilizing controlled illumination for creating or removing a con

1983-02-28

1984-06-12

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 156662, 427 531, 427 541, 427 93, 430297, 430298, 430311, 430323, 430324, H01L 21306

Patent

active

044540043

ABSTRACT:
A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.

REFERENCES:
patent: 3122463 (1964-02-01), Ligenza et al.
patent: 3390025 (1968-06-01), Strieter
patent: 3520684 (1970-07-01), Metlay et al.
patent: 3520685 (1970-07-01), Schaefer
Henry Nielsen & David Hackleman, Some Illumination on the Mechanism of SiO.sub.2 Etching in HF Solutions, Oct. 17, 1982, Electrochemical Society Extended Abstracts.

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