Using multiple thermal points to enable component level...

Details Using multiple thermal points to enable component level... Using multiple thermal points to enable component level...

2006-08-01

2006-08-01

Butler, Dennis M. (Department: 2115)

Electrical computers and digital processing systems: support

Computer power control

Power conservation

C713S324000

Reexamination Certificate

active

07085945

ABSTRACT:
A component in a computer includes multiple functional unit blocks (FUB). Each FUB may be associated with a sensor and may be managed individually. When the sensor detects that a problem associated with a particular FUB may arise, a controller may be used to adjust operation of the FUB instead of operation of the entire component.

REFERENCES:
patent: 5721837 (1998-02-01), Kikinis et al.
patent: 5798918 (1998-08-01), Georgiou et al.
patent: 6047248 (2000-04-01), Georgiou et al.
patent: 6363490 (2002-03-01), Senyk
patent: 6826705 (2004-11-01), Tani
patent: 6889332 (2005-05-01), Helms et al.
patent: 2004/0128100 (2004-07-01), Rotem

Affiliated with

Also associated with

Rating

Using multiple thermal points to enable component level... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Using multiple thermal points to enable component level..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Using multiple thermal points to enable component level... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3714429