Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate
2008-05-13
2008-05-13
Tsang-Foster, Susy (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
C205S082000, C205S083000
Reexamination Certificate
active
10816495
ABSTRACT:
A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage. In one embodiment, the voltage of a plating cell including a reference wafer which has substantially complete Cu seed coverage is measured. A reference resistance of the plating cell with the reference wafer is determined. The voltage of the plating cell including a calibration wafer which has no or insufficient seed coverage at its edge is measured. A calibration resistance of the plating cell with the calibration wafer is determined. An error trigger based on a comparison of the reference resistance with the calibration resistance is selected.
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Cao Yang
Chen Jir-shyr
Ma Yue
Rastogi Rajiv
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Leader William T.
Tsang-Foster Susy
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