Use of WEE (wafer edge exposure) to prevent polyimide contaminat

Details Use of WEE (wafer edge exposure) to prevent polyimide contaminat Use of WEE (wafer edge exposure) to prevent polyimide contaminat

1996-10-02

1998-10-20

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Plural exposure steps

430311, 430328, 430494, G03F 720

Patent

active

058244573

ABSTRACT:
A method is disclosed for sealing the edge of a wafer against slurry debris and contaminants that are encountered during grinding and backlapping of a semiconductor substrate. This is accomplished by depositing a photosensitive polyimide as a dielectric material on a wafer and mounting the wafer on a chuck. A light source is introduced above the wafer and close to the edge of the wafer. The chuck is then spun by means of a spindle, thus exposing an outer ring of the circumferential edge of the wafer to light source. Because polyimide behaves like a negative resist in the art of lithography, the exposed ring is fixed in place such that when the wafer is next developed, only the unexposed polyimide corresponding to the scribe line patterns is dissolved forming "scribe channels", while leaving the ring in tact all along the circumference of the wafer. This wafer edge exposure (WEE) then forms an edge, which, in conjunction with a grinding tape, seals the perimeter of the wafer, thus preventing the polishing contaminants from entering the scribe channels.

REFERENCES:
patent: 3936301 (1976-02-01), Schneider
patent: 4899195 (1990-02-01), Gotoh
patent: 5509974 (1996-04-01), Hays
S. Wolf, "Silicon Processing for the VLSI Era" vol. 2, Lattice Press, Sunset Beach, CA, pp. 196, 234, 214-215.

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