Use of residual organic compounds to facilitate gate break on a

Details Use of residual organic compounds to facilitate gate break on a Use of residual organic compounds to facilitate gate break on a

1998-02-05

2000-09-12

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438124, 438126, 438127, H01L 2148

Patent

active

061177083

ABSTRACT:
An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant material. An organic compound layer which inherently forms on the substrate during the fabrication of the substrate or during various chip attachment processes is masked in a predetermined location with a mask. The substrate is then cleaned to remove the organic compound layer. The mask protects the masked portion of the organic material layer which becomes a release layer to facilitate gate break.
An encapsulant mold is placed over the substrate and chip and an encapsulant material is injected into the encapsulant mold cavity through an interconnection channel. The release layer is formed in a position to reside as the bottom of the interconnection channel. Preferably, the interconnection channel has a gate adjacent the encapsulant mold cavity. The encapsulant material solidifies and the encapsulant mold is removed, wherein the gate forms an indentation abutting the cavity. Excess encapsulant solidified in the interconnection channel is leveraged from the surface of the substrate and broken free at the indentation. The remaining release layer may then be removed.

REFERENCES:
patent: 4460537 (1984-07-01), Heinle
patent: 4615857 (1986-10-01), Baird
patent: 4910581 (1990-03-01), Baird
patent: 5417826 (1995-05-01), Blalock
patent: 5434750 (1995-07-01), Rostoker et al.
patent: 5542171 (1996-08-01), Juskey et al.
patent: 5557150 (1996-09-01), Variot et al.
patent: 5635671 (1997-06-01), Freyman et al.
patent: 5656549 (1997-08-01), Woosley et al.
patent: 5780933 (1998-07-01), Ohmori et al.
patent: 5963792 (1999-10-01), Wensel

Affiliated with

Also associated with

Rating

Use of residual organic compounds to facilitate gate break on a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of residual organic compounds to facilitate gate break on a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of residual organic compounds to facilitate gate break on a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-95421