Use of fluorinated additives in the etching or polishing of...

Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...

Reexamination Certificate

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C216S089000, C252S079100, C252S079200, C252S079300, C252S079400

Reexamination Certificate

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10355072

ABSTRACT:
Use in etching or polishing of integrated circuits of fluorinated additives of formula (I):in-line-formulae description="In-line Formulae" end="lead"?T′(C3F6O)n(CFXO)mT  (I)in-line-formulae description="In-line Formulae" end="tail"?having a number average molecular weight in the range 250–400, in particular of the compound Cl(CF2—CF(CF3)O)nCF2COONa.

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