Use of ellipsometry and surface plasmon resonance in...

Optics: measuring and testing – By polarized light examination – Of surface reflection

Reexamination Certificate

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C356S364000, C356S365000, C356S366000, C356S367000, C356S368000

Reexamination Certificate

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11014298

ABSTRACT:
Improved methodology for monitoring deposition or removal of material to or from a process and/or wittness substrate which demonstrates a negative e1at some wavelength. The method involves detection of changes in P-polarized electromagnetism ellipsometric DELTA at SPR Resonance Angle-of-Incidence (AOI) to monitor deposition of and/or removal of minute amounts of materials onto, or from, said process and/or witness substrate. The methodology can optionally monitor ellipsometric PSI, and involves simultaneously or sequentially applying non-P-polarized electromagnetism at the same angle of incidence, or electromagnetic radiation of any polarization at a different angle-of-incidence and wavelength to the process or wittness substrate and application of conventional ellipsometric analysis.

REFERENCES:
patent: 5793480 (1998-08-01), Lacey et al.
patent: 5900633 (1999-05-01), Solomon et al.
“Automatic Rotating Element Ellipsometers: Calibration, Operation and Real-Time Applications”, Collins,Rev. Sci. Instrum., 61(8) (1990).
“Ceramic Surface Polariton Sensor”; Ribbing et al., Proc. SPIE, vol. 4103 (2000).

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