Use of electrostatic forces to reduce particle contamination in

Details Use of electrostatic forces to reduce particle contamination in Use of electrostatic forces to reduce particle contamination in

1993-03-15

1995-04-25

Paschall, Mark H.

Electric heating

Metal heating

By arc

21912143, 156345, 20429834, B23K 1000, H01L 2100, B44C 122

Patent

active

054101220

ABSTRACT:
Particles are repelled from the upper face of a wafer in a plasma chamber by inducing positive or negative charges on the substrate without generating a gas plasma above the substrate. The charges are induced in the substrate by bringing a conductive sheet carrying a DC voltage close to the underside of the substrate. The particle repelling effect may be enhanced by inducing alternating positive and negative charges in the substrate. This can be done by switching the polarity of the DC voltage applied to the conductive sheet, or alternatively by moving an actuator to repetitively ground and isolate the substrate from the chamber.

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Selwyn, "Plasma particulate contamination control II. Self-cleaning tool design", Journal of Vacuum Science and Technology, 10(4), Jul./Aug. 1992.

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