Use of depolymerizable polymers in the fabrication of lift-off s

Details Use of depolymerizable polymers in the fabrication of lift-off s Use of depolymerizable polymers in the fabrication of lift-off s

1984-06-11

1985-05-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 29591, 156644, 156646, 156652, 156655, 1566611, 156668, 204192E, 357 71, 427 90, 430314, 430317, 430329, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

045198721

ABSTRACT:
An improved lift-off process for multilevel metal structure in the fabrication of integrated circuits by employing lift-off layer formed from polymers which undergo clean depolymerization under the influence of heat or radiation and allow rapid and residue-free release of an "expendable mask". An embedded interconnection metallurgy system is formed by application of the lift-off layer of this invention over a cured polymer film or on an oxygen RIE barrier layer previously deposited on organic or inorganic substrate, followed by another barrier over which is then coated a radiation sensitive resist layer. After definition of the desired resist pattern by imagewise exposure and development, the image is replicated into the barrier by sputter etching in a fluorine containing ambient and subsequently into the base layer down to the substrate by oxygen reactive ion etching which is followed by blanket metal evaporation and finally the lift-off by brief heat treatment at the depolymerization temperature of the lift-off layer, and brief solvent soak.

REFERENCES:
patent: 2559389 (1951-07-01), Beeber et al.
patent: 3535137 (1970-10-01), Haller et al.
patent: 3849136 (1974-11-01), Grebe
patent: 3934057 (1976-01-01), Moreau et al.
patent: 3985597 (1976-10-01), Zielinski
patent: 4004044 (1977-01-01), Franco et al.
patent: 4119483 (1978-10-01), Hubsch et al.
patent: 4181755 (1980-01-01), Liu et al.
patent: 4202914 (1980-05-01), Havas et al.
patent: 4224361 (1980-09-01), Romankiw
patent: 4272561 (1981-06-01), Rothman et al.
patent: 4328263 (1982-05-01), Kurahashi et al.
patent: 4367119 (1983-01-01), Logan et al.
IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, p. 541 for "Gamma Radiation Treatment to Enhance the Unzipping of Poly . . . ".
IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979 for "Unzippable Polymers for Green Sheets", by H. R. Anderson, Jr. et al., p. 542.
IBM Technical Disclosure Bulletin, vol. 15, No. 1, Jun. 1972, p. 174 for "Solventless Development of Polymeric Films", by C. A. Cortellino et al.
NEPCON Prize Paper Contest-Technical Session 11: "Hybrid Circuit Components and Assemblies", by K. C. Hu, Radio Corporation of America Laboratories, Princeton, N.J.--Expendable Mask: A New Technique for Patterning Evaporated Metallic Films, Oct. 1967--pp. 84-94.

Affiliated with

Also associated with

Rating

Use of depolymerizable polymers in the fabrication of lift-off s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of depolymerizable polymers in the fabrication of lift-off s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of depolymerizable polymers in the fabrication of lift-off s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-867285