Use of a heat pipe integrated with the IC package for improving

Details Use of a heat pipe integrated with the IC package for improving Use of a heat pipe integrated with the IC package for improving

1988-07-18

1990-03-27

Hille, Rolf

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

16510433, H01L 2504

Patent

active

049125486

ABSTRACT:
A CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof. A quantity of working fluid, such as fluorinated octane, is contained within the package cavity. The heat pipe communicates with cooling fins that produce a cold end thereof. Heat from the semiconductor device inside the housing boils the working fluid and is cooled thereby. The fluid vapor passes along the heat pipe and is condensed at the cold end to be converted back to liquid. As a result the semiconductor device is in direct communication with the heat pipe working fluid.

REFERENCES:
patent: 3792318 (1974-02-01), Fries et al.
patent: 3980133 (1976-09-01), Mitsuoka et al.
patent: 3986550 (1976-10-01), Mitsuoka
patent: 4053942 (1977-10-01), Dougherty, Jr. et al.
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4675783 (1987-06-01), Murase et al.
IBM Technical Disclosure Bulletin, vol. 14, No. 9, Feb. 1972, p. 2690, Substrate Mounted Heat Pipe for Chip Cooling, E. J. Bakelaar, C. G. Ingram and Q. K. Kerjilian.

Affiliated with

Also associated with

Rating

Use of a heat pipe integrated with the IC package for improving does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of a heat pipe integrated with the IC package for improving , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of a heat pipe integrated with the IC package for improving will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1654995