Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With gas inlet structure
Reexamination Certificate
2006-12-15
2010-12-21
Kackar, Ram N (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With gas inlet structure
C118S715000
Reexamination Certificate
active
07854820
ABSTRACT:
Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.
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International Search Report and Written Opinion dated Mar. 20, 2008 for PCT/US2007/021989.
Augustino Jason
Comendant Keith
De La Llera Anthony
Denty, Jr. William M.
Dhindsa Rajinder
Buchanan & Ingersoll & Rooney PC
Chandra Satish
Kackar Ram N
Lam Research Corporation
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