Universal leadframe for semiconductor devices

Details Universal leadframe for semiconductor devices Universal leadframe for semiconductor devices

1998-05-28

2000-08-08

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361813, 257666, 257676, 257783, 257787, 174 524, 438123, 438124, H01L 23495

Patent

active

061011010

ABSTRACT:
A leadframe for semiconductor devices is characterized in that the edge of the paddle has the shape of inclined plane which facilitate the silver epoxy to fill up the gap near the edge of the epoxy. The inclined plane on the paddle can also prevent the excessive silver epoxy from leaking to the bottom side of the paddle, which may cause delamination due to the poor adhesion between silver epoxy and plastic resin. Therefore the leadframe of the present utility can prevent moisture from accumulating within the package and the problem of pop corn.

REFERENCES:
patent: 5942794 (1999-08-01), Okumura et al.
patent: 5977615 (1999-11-01), Yamaguchi et al.

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