Uniformity of copper etching in the fabrication of multilayer pr

Details Uniformity of copper etching in the fabrication of multilayer pr Uniformity of copper etching in the fabrication of multilayer pr

1991-06-03

1992-07-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156656, 156666, 156345, 156902, 252 794, 252 795, B44C 122, C23F 100

Patent

active

051279916

ABSTRACT:
This invention is a process for etching copper sheets on insulating boards for use in fabricating multilayer printed circuit boards. The improvement resides in adding to a standard copper etching solution certain alkyltrimethyl ammonium chlorides with alkyl chain lengths ranging from 6 to 20 carbon atoms in amounts sufficient to yield intermediate kinetics behavior. Of special interest are dodecyltrimethyl ammonium chloride, hexadecyltrimethyl ammonium chloride and octadecyltrimethyl ammonium chloride present in an amount of from 0.01 to 1.0 wt %. A silicon-based antiforming agent may be added in amounts of from 0.05 to 2.0 wt. % to prevent an unacceptably large amount of foam from occurring during etching. With this formulation, the rate is mass transport controlled at low rates and almost independent of mass transport at high rates due to the inhibition of the surface reaction rate. As a result, non-uniformities in etch rates due to variations in mass transport conditions in processing equipment may be eliminated. This unique formulation could significantly improve the yields presently obtained in manufacturing as well as allow the processing of fine-line multilayer circuit boards.

REFERENCES:
Veniamin G. Levich, Physiochemical Hydrodynamics 1962, Prentice-Hall, Inc., pp. 93-102.
John S. Newman, Electrochemical Systems 1973, Prentice-Hall, Inc., pp. 307-310.
R. E. Markle, Processing and Economic Aspects of Etchant Regeneration, Plating and Surface Finishing, Jan. 1983, pp. 58"62.
V. V. Isaev et al., Zasch, Met., vol. 13, No. 4, Jul. 1977, pp,. 444-445.
A. F. Bogenschuetz et al., Chemical Abstracts, vol. 90, No. 161138z, 1979.
A. Tanaka, Chemical Abstracts, vol. 105, No. 105-106957u, 1986.

Affiliated with

Also associated with

Rating

Uniformity of copper etching in the fabrication of multilayer pr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Uniformity of copper etching in the fabrication of multilayer pr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Uniformity of copper etching in the fabrication of multilayer pr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1827339