Uniform film thickness deposition of sputtered materials

Details Uniform film thickness deposition of sputtered materials Uniform film thickness deposition of sputtered materials

1996-05-14

1999-07-06

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1434

Patent

active

059193450

ABSTRACT:
A sputtering chamber includes a substrate support member, for positioning a substrate thereon, and a sputtering target therein. At least a portion of the sputtering surface of the target is located non-parallel to the substrate. In one aspect of the invention, the sputtering surface of the target is conical, and it tapers as it approaches the substrate.

REFERENCES:
patent: 3654110 (1972-04-01), Kraus
patent: 3988232 (1976-10-01), Wasa et al.
patent: 4394236 (1983-07-01), Robinson
patent: 4414086 (1983-11-01), Lamont, Jr.
patent: 4457825 (1984-07-01), Lamont, Jr.
patent: 4547279 (1985-10-01), Kiyota et al.
patent: 4622121 (1986-11-01), Wegmann et al.
patent: 4673480 (1987-06-01), Lamont, Jr.
patent: 4721553 (1988-01-01), Saito et al.
patent: 4747926 (1988-05-01), Shimizu et al.
patent: 4756810 (1988-07-01), Lamont, Jr. et al.
patent: 4957605 (1990-09-01), Hurwitt et al.
patent: 5194131 (1993-03-01), Anderson
patent: 5252194 (1993-10-01), Demaray et al.
patent: 5320728 (1994-06-01), Tepman
patent: 5490913 (1996-02-01), Schertler et al.
patent: 5556525 (1996-09-01), Krivokapic et al.

Affiliated with

Also associated with

Rating

Uniform film thickness deposition of sputtered materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Uniform film thickness deposition of sputtered materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Uniform film thickness deposition of sputtered materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-896654