Uniform and repeatable plasma processing

Details Uniform and repeatable plasma processing Uniform and repeatable plasma processing

1994-07-29

1995-12-12

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 1566431, 216 61, 216 67, H01L 21306, B44C 122

Patent

active

054746485

ABSTRACT:
Dynamic control and delivery of radio frequency power in plasma process systems is utilized to enhance the repeatability and uniformity of the process plasma. Power, voltage, current, phase, impedance, harmonic content and direct current bias of the radio frequency energy being delivered to the plasma chamber may be monitored at the plasma chamber and used to control or characterize the plasma load. Dynamic pro-active control of the characteristics of the radio frequency power to the plasma chamber electrode during the formation of the plasma enhances the uniformity of the plasma for more exact and controllable processing of the work pieces.

REFERENCES:
patent: 4602981 (1986-07-01), Chen et al.
patent: 4954212 (1990-09-01), Gabriel et al.
patent: 5401350 (1995-03-01), Patrick et al.
patent: 5407524 (1995-04-01), Patrick et al.

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