4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Mark P. Jamieson

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Method for creating printed circuit board substrates having...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Printed circuit board substrate having solder mask-free edges

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Underside heat slug for ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1211944

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