Underfill system for semiconductor package

Details Underfill system for semiconductor package Underfill system for semiconductor package

2005-05-24

2005-05-24

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S740000, C029S743000, C029S832000, C029S834000, C438S126000

Reexamination Certificate

active

06895666

ABSTRACT:
An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-ducts each having an outlet being connected to the main duct and an inlet to be located along one side of the semiconductor chip. A filling material from a dispenser fills the gaps by suction due to the pressure difference between the main duct and the sub-duct. Thus, the present invention shortens the filling time of the underfill process and prevents voids or air bubbles of the filling material from forming within the gap.

REFERENCES:
patent: 5866442 (1999-02-01), Brand
patent: 6048656 (2000-04-01), Akram et al.
patent: 6253834 (2001-07-01), Sterner
patent: 6534345 (2003-03-01), Muff et al.

Affiliated with

Also associated with

Rating

Underfill system for semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Underfill system for semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Underfill system for semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3369763