Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2004-09-29
2008-09-09
Sellers, Robert (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C525S109000, C525S113000, C525S114000, C525S486000, C525S523000, C525S524000, C525S529000, C525S530000, C525S533000
Reexamination Certificate
active
07423096
ABSTRACT:
An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.
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Greaves John N.
Intel Corporation
Sellers Robert
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