Underfill integration for optical packages

Details Underfill integration for optical packages Underfill integration for optical packages

2007-08-14

2007-08-14

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

Reexamination Certificate

active

11036302

ABSTRACT:
The application discloses an apparatus comprising an optical die flip-chip bonded to a substrate and defining a volume between the optical die and the substrate, the optical die including an optically active area on a surface of the die facing the substrate, an optically transparent material occupying at least those portions of the volume substantially corresponding with the optically active area, and an underfill material occupying portions of the volume not occupied by the optically transparent material. Also disclosed is a process comprising flip-chip bonding an optical die to a substrate, the optical die including at least one optically active area on a surface thereof facing the substrate, dispensing an optically transparent material between the optical die and the substrate, wherein the optically transparent material covers the at least one optically active area, dispensing an underfill material in the volume between the optical die and the substrate not occupied by the optically transparent material, and curing the optically transparent material and the underfill material. Other embodiments are described and claimed.

REFERENCES:
patent: 6571466 (2003-06-01), Glenn et al.
patent: 6661939 (2003-12-01), Kaneko et al.
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patent: 2002/0058742 (2002-05-01), Honda et al.
patent: 2004/0118599 (2004-06-01), Chason et al.

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