Underfill coating for LOC package

Details Underfill coating for LOC package Underfill coating for LOC package

1996-05-21

1998-03-31

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437217, 437219, H01L 2160

Patent

active

057338000

ABSTRACT:
An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die, extending from the bonding location of the die and the edge of the die, in order to prevent filler particles from lodging between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The seal created by the underfill material reduces point stresses on the active surface of the die usually caused by the filler particles. The decreased flexure in the leads further enhances the locking of the leads in position with respect to the die.

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