Undercut membrane mask for high energy photon patterning

Details Undercut membrane mask for high energy photon patterning Undercut membrane mask for high energy photon patterning

1991-11-14

1994-07-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156628, 156647, 156651, 156657, 1566591, 156662, 156644, 156345, 428137, 21912169, 21912185, H01L 21306, B44C 122, C03C 1500

Patent

active

053264266

ABSTRACT:
A mask for use with high energy radiation sources in precision projection processing by excimer lasers, for example, is described. The mask comprises a suitable substrate, such as silicon, upon which a multilayer dielectric stack is formed which acts as a reflective coating for the impinging excimer laser radiation, minimizing energy absorption by the mask substrate. The mask transparent areas are defined by the through-holes in the mask. The through-holes are formed with a conically undercut edge profile to define a thin object plane for the mask and minimize scattering of the radiation from the through-hole sidewalls. A method for fabricating the mask is also described.

REFERENCES:
patent: 4256532 (1981-03-01), Magdo et al.
patent: 4417946 (1983-11-01), Bohlen et al.
patent: 4419182 (1983-12-01), Westerberg
patent: 4478677 (1984-10-01), Chen et al.
patent: 4490210 (1984-12-01), Chen et al.
patent: 4490211 (1984-12-01), Chen et al.
patent: 4923772 (1990-05-01), Krich et al.
A. Tam, et al., "Mask for Excimer Laser Ablation and Method of Producing Same", IBM Technical Disclosure Bulletin, vol. 33, No. 1A Jun. 1990, pp. 388-390.

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