Ultrathin form factor MEMS microphones and microspeakers

Details Ultrathin form factor MEMS microphones and microspeakers Ultrathin form factor MEMS microphones and microspeakers

2005-08-30

2005-08-30

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S455000, C438S050000, C438S052000, C438S053000, C438S048000, C438S464000, C438S977000

Reexamination Certificate

active

06936524

ABSTRACT:
A process comprises reducing the thickness of a substrate carrying a plurality of devices, with at least certain of the devices having a micro-machined mesh. A carrier wafer is attached to the back side of the substrate and the fabrication of the devices is completed from the top side of the substrate. Thereafter the plurality of devices is singulated. Various alternative embodiments are disclosed which demonstrate that the thinning of the wafer may occur at different times during the process of fabricating the MEMS devices such as before the mesh is formed or after the mesh is formed. Additionally, the use of carrier wafers to support the thinned wafer enables process steps to be carried out on the side opposite from the side having the carrier wafer. The various alternative embodiments demonstrate that the side carrying the carrier wafer can be varied throughout the process.

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