Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1989-08-11
1990-12-11
Heinrich, Sam
Metal fusion bonding
Process
With condition responsive, program, or timing control
228111, 228 11, 228 8, 228 13, B23K 2010
Patent
active
049763920
ABSTRACT:
An improved ultrasonic wire bonding method and apparatus is disclosed having a wire delivery conduit for removing coil set in the wire through a serpentine movement prior to being bonded, which also provides sufficient drag to prevent displacement as the bonder with the wire is being moved from one location to another, and which orients the wire to said bonding tool end. An improved wire cutter moves independently of the wire bonding tool and is directly connected to the main Z positioning movement of said wire bonder so that the wire bonding tool and the cutter can move independently during the process. The wire bonding tool can be biased by a magnetic bias with an armature connected to the wire bonding tool. The wire bonding apparatus and the method provide a loop in the wire between first and second bonds by forming an arcuate bend in the wire as it moves away from the first point of bonding. After a second bond, the wire is partially cut by a cutter that moves relative to the bonding tool to partially cut the wire which is then severed by pulling the bonding tool and cleating the wire in the end thereof.
REFERENCES:
patent: 3460238 (1967-04-01), Christy et al.
patent: 4239144 (1980-12-01), Elles et al.
patent: 4418858 (1983-12-01), Miller
patent: 4550871 (1985-11-01), Chan et al.
patent: 4619397 (1986-10-01), Urban
patent: 4789095 (1988-12-01), Kobayashi
IBM Technical Disclosure Bulletin, "Cutting Fine Lead Wires . . . ", vol. 10, No. 3, p. 190, Aug. 1967.
IBM Technical Disclosure Bulletin, "Ultrasonic Bonding Tip", vol. 10, No. 12, p. 1892, May 1968.
Smith Michael C.
Smith, Jr. Hal W.
Bethel George F.
Bethel Patience K.
Heinrich Sam
Orthodyne Electronics Corporation
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