Ultrasonic wave assisted contact hole filling

Details Ultrasonic wave assisted contact hole filling Ultrasonic wave assisted contact hole filling

1996-09-24

1998-12-22

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

1565801, 156 731, 156382, 264442, 228262, H01L 21463

Patent

active

058513442

ABSTRACT:
A method of eliminating or substantially eliminating voids formed in the bottom of high aspect ratio holes following the physical vapor deposition of a material over the surface of a substrate. The method includes placing the substrate in an ultrasonic processing chamber filled with a fluid and having an ultrasonic source. The ultrasonic source is used to generate ultrasonic waves at a frequency no higher than is sufficient to cause a flow of the material adjacent the voids into these voids, without significantly affecting the deposited material elsewhere on the substrate.

REFERENCES:
patent: 5520784 (1996-05-01), Ward

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