Ultrasonic wave assisted contact hole filling

Details Ultrasonic wave assisted contact hole filling Ultrasonic wave assisted contact hole filling

1995-12-12

1997-03-11

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437 9, 437245, 427600, H01L 21463

Patent

active

056101031

ABSTRACT:
A method of eliminating or substantially eliminating voids formed in the bottom of high aspect ratio holes following the physical vapor deposition of a material over the surface of a substrate. The method includes placing the substrate in an ultrasonic processing chamber filled with a fluid and having an ultrasonic source. The ultrasonic source is used to generate ultrasonic waves at a frequency no higher than is sufficient to cause a flow of the material adjacent the voids into these voids, without significantly affecting the deposited material elsewhere on the substrate.

REFERENCES:
patent: 3955270 (1976-05-01), Loya

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