Ultrasonic manufacturing apparatus

Details Ultrasonic manufacturing apparatus Ultrasonic manufacturing apparatus

2005-08-09

2005-08-09

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C156S580200

Reexamination Certificate

active

06926187

ABSTRACT:
The present invention pertains to a multilayer flexible wiring board.The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

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