Ultrasonic enhancement of aluminum step coverage and apparatus

Details Ultrasonic enhancement of aluminum step coverage and apparatus Ultrasonic enhancement of aluminum step coverage and apparatus

1995-05-31

1996-05-28

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419217, 20429809, 20429815, 20429829, C23C 1434

Patent

active

055207847

ABSTRACT:
A method and apparatus for sputter depositing aluminum onto a semiconductor substrate to fill micron and submicron vias utilizes ultrasonic energy to ensure adequate filling of the vias. The semiconductor is supported on a block and heated and subjected to ultrasonic energy greater than 25 kHz as aluminum is sputter deposited onto the substrate surface. The frequency of the ultrasonic energy is varied from 35 to 42 kHz as the aluminum is deposited in order to avoid standing wave or node formation along the substrate surface. This permits for an efficient high quality application of aluminum and filling of vias on a semiconductor substrate.

REFERENCES:
patent: 4384918 (1983-05-01), Abe
patent: 4388517 (1983-06-01), Schulte et al.
patent: 4473455 (1984-09-01), Dean et al.
patent: 4521286 (1985-06-01), Horwitz
patent: 4661228 (1987-04-01), Mintz
patent: 4721689 (1988-01-01), Chaloux, Jr. et al.
patent: 4791074 (1988-12-01), Tsunashima et al.
patent: 4883574 (1989-11-01), dos Santos Pereina Ribeiro
patent: 4891112 (1990-01-01), Wong
patent: 4897171 (1990-01-01), Ohmi
patent: 4970176 (1990-11-01), Tracy et al.
patent: 4994162 (1991-02-01), Armstrong et al.
patent: 4999096 (1991-03-01), Nihei et al.
patent: 5057185 (1991-10-01), Thomas et al.
patent: 5171412 (1992-12-01), Talieh et al.

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