Ultrasonic dimension measuring apparatus

Details Ultrasonic dimension measuring apparatus Ultrasonic dimension measuring apparatus

1986-11-07

1989-01-31

Levy, Stewart J.

Measuring and testing

Vibration

By mechanical waves

G01N 2900

Patent

active

048007579

ABSTRACT:
An apparatus for measuring a dimension of an object by using ultrasonic waves includes: a pair of probes spaced apart one of the probes being to face a top surface of the object and the other of the probes being to face a bottom surface of the object; control for choosing what to be currently measured from three kinds of travelling periods of time which ultrasonic pulses take: to propagate between the probes; to travel between the top surface of the object and the probe facing the top surface; and to travel between the bottom surface of the object and the other probe facing the bottom surface and apparatus responsive to the transmission and reception signals for evaluating the three kinds of travelling periods of time and for calculating the dimension of the object from the evaluated travelling periods, whereby the probes can be out of touch with the surfaces of the object. Additionally the apparatus includes a monitor to determine whether a test object is present between the probes to start the control system.

REFERENCES:
patent: 3603680 (1969-12-01), Barton
patent: 3844163 (1974-10-01), DiLeo
patent: 4368438 (1983-01-01), Stinestra
patent: 4594897 (1986-06-01), Bartz
J. B. Beyer, et al., "Microwave Thickness Detector", Rev. of Sci. Inst., Mar. 1960, vol. 31, No. 3, pp. 313-316.

Affiliated with

Also associated with

Rating

Ultrasonic dimension measuring apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic dimension measuring apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic dimension measuring apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-171850