Ultrasonic bonding apparatus and method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1563084, 156553, 156568, 1565801, 493193, 493208, B29C 6508

Patent

active

047582936

ABSTRACT:
Apparatus and method for ultrasonically bonding a web utilizes ultrasonic bonders having respective anvil and sonotrode components which are synchronously orbited with each other and with the rotation of a rotatable drum which carries the web of material to be bonded. One of the anvil and sonotrode components is orbited exteriorly of the drum and the other interiorly of the drum and they are brought into facing alignment through openings in the drum to clamp segments of the material therebetween during passage through a bonding segment of the travel path of the web about the drum. The bonder component orbiting exteriorly of the drum is axially translated away from the anvil along the drum in order to provide clearance for withdrawal of the bonded material from the drum. In this manner, an ultrasonic bonder may clamp the material at a single location for a large segment of its travel along the rotation path of the drum, thereby attaining a bonding time not limited entirely by the travel speed of the web.

REFERENCES:
patent: 3837977 (1974-09-01), Rust
patent: 3844869 (1974-10-01), Rust
patent: 4047992 (1977-09-01), Williams et al.
patent: 4159220 (1979-06-01), Bosche et al.
patent: 4193833 (1980-03-01), Young
patent: 4305240 (1981-12-01), Grevich et al.
patent: 4332578 (1982-06-01), Van der Meulen
patent: 4414045 (1983-11-01), Wang et al.
patent: 4490199 (1984-12-01), Dunning
patent: 4614078 (1986-09-01), Kawabe
patent: 4650530 (1987-03-01), Mahoney et al.
patent: 4713132 (1987-12-01), Abel et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ultrasonic bonding apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic bonding apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic bonding apparatus and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-595439

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.