Ultrasonic array with a high density of electrical connections

Details Ultrasonic array with a high density of electrical connections Ultrasonic array with a high density of electrical connections

1990-04-05

1992-02-25

Kyle, Deborah L.

Communications, electrical: acoustic wave systems and devices

Signal transducers

Underwater type

367155, 310334, 29 2535, 12866203, H04R 1700

Patent

active

050918931

ABSTRACT:
A piezoelectric ultrasonic array transducer has its individual elements connected to external electronics via a high density interconnect structure which facilitates signal connection and uniformity from array-to-array. The array fabrication process is preferably modified for use with a high density interconnect structure in order to obtain maximum transducer quality.

REFERENCES:
patent: 4371805 (1983-02-01), Diepers et al.
patent: 4747192 (1988-05-01), Rokurota

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