Ultra thin image sensor package structure and method for...

Details Ultra thin image sensor package structure and method for... Ultra thin image sensor package structure and method for...

2006-09-05

2006-09-05

Abraham, Fetsum (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Non-single crystal, or recrystallized, semiconductor...

Amorphous semiconductor material

C257S072000, C257S084000, C257S666000

Reexamination Certificate

active

07102159

ABSTRACT:
An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

REFERENCES:
patent: 6274927 (2001-08-01), Glenn
patent: 6384472 (2002-05-01), Huang
patent: 6526653 (2003-03-01), Glenn et al.
patent: 6643919 (2003-11-01), Huang

Affiliated with

Also associated with

Rating

Ultra thin image sensor package structure and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultra thin image sensor package structure and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultra thin image sensor package structure and method for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3556568