Ultra-thin circuit fabrication by controlled wafer debonding

Details Ultra-thin circuit fabrication by controlled wafer debonding Ultra-thin circuit fabrication by controlled wafer debonding

1990-04-16

1992-02-25

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 86, 437974, 437226, 148DIG28, 156630, H01L 21304, H01L 2176

Patent

active

050913310

ABSTRACT:
A process including forming peaks and valleys in a bonding surface of a first wafer so that the peaks are at the scribe lines which define dice. The peaks and not the valleys of the first wafer is bonded to a bonding surface of a second wafer. The device forming steps are performed on one of the wafers. Finally, the wafer in which the devices are formed is cut through at the peaks to form the dice. The peaks may be substantially the size of the kerf produced by the cutting such that the dice are separated from the other wafer by the cutting step. Alternately, the peaks may have a width greater than the kerf produced by the cutting and remain attached to the other wafer by the remaining peak portions. The dice are then separated from the other wafer at the remaining peak portions by an additional step.

REFERENCES:
patent: 4121334 (1978-10-01), Wallis
patent: 4784970 (1988-11-01), Solomon
patent: 4975390 (1990-12-01), Fujii et al.
Bushman, T. D., "Dicing Techniques--A Survey" SCP & Solid State Technology, 11/64, pp. 38-42.

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