Ultra short trench transistors and process for making same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257395, 257396, 257397, 257401, 257408, 257900, H01L27/088

Patent

active

059052856

ABSTRACT:
A field effect transistor comprising a semiconductor substrate having a transistor trench extending downward from an upper surface of the semiconductor substrate. The trench extends to a trench depth below an upper surface of the semiconductor substrate. The transistor further includes a gate dielectric layer that is formed on a floor of the transistor trench over a channel region of the semiconductor substrate. A conductive gate structure is formed above and in contact with the gate dielectric layer. A source/drain impurity distribution is formed within a source/drain region of the semiconductor substrate. The source/drain region is laterally disposed on either side of the channel region of the semiconductor substrate. In a preferred embodiment, the trench depth is between 1,000-5,000 angstroms and a thickness of the conductive gate structure is less than 5,000 angstroms such that an upper surface of the conductive gate structure is level with or below an upper surface of the semiconductor substrate. The gate dielectric layer suitably comprises a thermal oxide having a thickness of approximately 20-200 angstroms. In a lightly doped drain (LDD) embodiment, the source/drain impurity distribution includes a lightly doped region and a heavily doped region. The lightly doped region extends laterally from the channel region of the transistor to the heavily doped region. In the preferred embodiment, a lateral dimension of the channel region of the transistor is approximately 100-300 nm.

REFERENCES:
patent: 4324038 (1982-04-01), Chang
patent: 4745081 (1988-05-01), Beyer et al.
patent: 4835585 (1989-05-01), Panousis
patent: 5068696 (1991-11-01), Yang et al.
patent: 5190792 (1993-03-01), Blum et al.
patent: 5296410 (1994-03-01), Yang
patent: 5374575 (1994-12-01), Kim et al.
patent: 5408116 (1995-04-01), Tanaka et al.
patent: 5472894 (1995-12-01), Hsu et al.
patent: 5559357 (1996-09-01), Krivorapic
patent: 5648670 (1997-07-01), Blanchard
patent: 5719067 (1998-02-01), Gardner et al.
patent: 5780896 (1998-07-01), Ono
Patent Abstracts of Japan, vol. 095, No. 007, Aug. 31, 1995, & JP 07 106560 A (Ricoh Co. Ltd.), Apr. 22, 1995.
Patent Abstracts of Japan, vol. 015, No. 165 (E-1061), Apr. 25, 1991 & JP 03 036766 A (Seiko Instr. Inc.), Feb. 18, 1991.
Patent Abstracts of Japan, vol. 010, No. 075 (E-390), Mar. 25, 1986 & JP 60 220973 A (Toshiba KK), Nov. 5, 1985.
Patent Abstracts of Japan, vol. 016, No. 108 (E-1179), Mar. 17, 1992 & JP 03 283670 A (Fuji Electric Co. Ltd.), Dec. 13, 1991.
Patent Abstracts of Japan, vol. 016, No. 297 (E-1226), Jun. 30, 1992 & JP 04 079321 A (NEC Corp.), Mar. 12, 1992.
Patent Abstracts of Japan, vol. 013, No. 525 (E-850), Nov. 22, 1989 & JP 01 214057 A (Yamaha Corp.), Aug. 28, 1989.
International Search Report for PCT/US 97/16260 dated Dec. 16, 1997.

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