Ultra-high vacuum apparatus and method for high productivity phy

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20429807, 20429809, 20429812, 20429819, 2042982, C23C 1434, C23C 1435

Patent

active

060398485

ABSTRACT:
A magnetron sputtering system is provided that uses a backing plate assembly having an insulating spacer ring coupled between and hermetically sealed to the backing plate and an extender ring. The insulating spacer ring can be constructed from a ceramic material, and the extender ring can be constructed from a metal material. The use of this backing plate assembly allows the backing plate assembly to be coupled directly to the chamber walls with a metal-to-metal contact, while the backing plate remains electrically isolated from the chamber walls. This allows the sealing of a vacuum chamber in the magnetron sputtering system using a seal suitable for creating an ultra-high vacuum in the vacuum chamber.

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