Ultra-fine area array pitch probe card

Details Ultra-fine area array pitch probe card Ultra-fine area array pitch probe card

2007-07-10

2010-06-08

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010, C324S762010

Reexamination Certificate

active

07733102

ABSTRACT:
A system and a method of testing a semiconductor die is provided. An embodiment includes a printed circuit board connected to a space transformation layer, which is connected to a substrate. The substrate uses through silicon vias and a redistribution layer to reduce the pitch of the connections beyond the historical limitations. A probe head using Cobra-style probe pins is connected to the redistribution layer through C4 bumps.

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