Ultra dense trench-gated power device with the reduced...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S242000, C257S328000, C257S332000

Reexamination Certificate

active

07098500

ABSTRACT:
The cellular structure of the power device includes a substrate that has a highly doped drain region. Over the substrate there is a more lightly doped epitaxial layer of the same doping. Above the epitaxial layer is a well region formed of an opposite type doping. Covering the wells is an upper source layer of the first conductivity type that is heavily doped. The trench structure includes a sidewall oxide or other suitable insulating material that covers the sidewalls of the trench. The bottom of the trench is filled with a doped polysilicon shield. An interlevel dielectric such as silicon nitride covers the shield. The gate region is formed by another layer of doped polysilicon. A second interlevel dielectric, typically borophosphosilicate glass (BPSG) covers the gate. In operation, current flows vertically between the source and the drain through a channel in the well when a suitable voltage is applied to the gate.

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patent: 2002/0096714 (2002-07-01), Zeng et al.
patent: 2002/0135007 (2002-09-01), Koike et al.
patent: 1170803 (2002-01-01), None
patent: WO 02/13257 (2002-02-01), None

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