Two step wire bond process

Details Two step wire bond process Two step wire bond process

1997-10-02

2000-12-26

Chaudhuri, Olik

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438120, 438612, 438613, 2281805, 228904, H01L 2144

Patent

active

06165888&

ABSTRACT:
A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished by applying a relatively large force to the rounded tip (19), and a relatively low vibrating displacement to the flattened wire tip (19). During a second step the large force is reduced, however; the vibrating displacement is increased. The total time for the two step wire bonding process is slightly less than a prior art one step process.

REFERENCES:
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4661192 (1987-04-01), McShane
patent: 4907734 (1990-03-01), Conru et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5201454 (1993-04-01), Alfaro et al.
patent: 5249450 (1993-10-01), Wood et al.
patent: 5293073 (1994-03-01), Ono
patent: 5302550 (1994-04-01), Hirota et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5550407 (1996-08-01), Ogashiwa
patent: 5558270 (1996-09-01), Nachon et al.
patent: 5633204 (1997-05-01), Tago et al.
patent: 5740956 (1998-04-01), Seo et al.
patent: 5871141 (1999-02-01), Hadar et al.
patent: 5874780 (1999-02-01), Murakami
patent: 5884830 (1999-03-01), Yamazaki et al.
patent: 5938105 (1999-08-01), Singh
patent: 6001724 (1999-12-01), Stansbury
patent: 6041995 (2000-03-01), Takahashi et al.
patent: 6080651 (2000-06-01), Takahashi et al.
patent: 6098868 (2000-08-01), Mae et al.

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