Two step copper electroplating process with anneal for...

Details Two step copper electroplating process with anneal for... Two step copper electroplating process with anneal for...

2011-06-21

2011-06-21

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21586, C257SE21311, C257SE21591

Reexamination Certificate

active

07964506

ABSTRACT:
A two-step semiconductor electroplating process deposits copper onto wafers coated with a semi-noble metal in manner that is uniform across the wafer and free of voids after a post electrofill anneal. A seed-layer plating bath nucleates copper uniformly and conformably at a high density in a very thin film using a unique pulsed waveform. The wafer is then annealed before a second bath fills the features. The seed-layer anneal improves adhesion and stability of the semi-noble to copper interface, and the resulting copper interconnect stays void-free after a post electrofill anneal.

REFERENCES:
patent: 1969553 (1934-08-01), Gernes
patent: 3652442 (1972-03-01), Powers et al.
patent: 3706651 (1972-12-01), Leland
patent: 3862891 (1975-01-01), Smith
patent: 4033833 (1977-07-01), Bestel et al.
patent: 4082638 (1978-04-01), Jumer
patent: 4240886 (1980-12-01), Hodges et al.
patent: 4272335 (1981-06-01), Combs
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4357220 (1982-11-01), Eisenmann
patent: 4469564 (1984-09-01), Okinaka et al.
patent: 4604177 (1986-08-01), Sivilotti
patent: 4604178 (1986-08-01), Fleegener et al.
patent: 4605482 (1986-08-01), Shiragami et al.
patent: 4696729 (1987-09-01), Santini
patent: 4828654 (1989-05-01), Reed
patent: 4906346 (1990-03-01), Hadersbeck et al.
patent: 4931149 (1990-06-01), Stierman et al.
patent: 4933061 (1990-06-01), Kulkarni et al.
patent: 5039381 (1991-08-01), Mullarkey
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5146136 (1992-09-01), Ogura et al.
patent: 5156730 (1992-10-01), Bhatt et al.
patent: 5162079 (1992-11-01), Brown
patent: 5217586 (1993-06-01), Datta et al.
patent: 5316642 (1994-05-01), Young, Jr. et al.
patent: 5368711 (1994-11-01), Poris
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5443707 (1995-08-01), Mori
patent: 5472592 (1995-12-01), Lowery
patent: 5476578 (1995-12-01), Forand
patent: 5498325 (1996-03-01), Nishimura et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5913147 (1999-06-01), Dubin et al.
patent: 5935402 (1999-08-01), Fanti
patent: 5982606 (1999-11-01), Masuda et al.
patent: 6027631 (2000-02-01), Broadbent
patent: 6113771 (2000-09-01), Landau et al.
patent: 6126798 (2000-10-01), Reid et al.
patent: 6132587 (2000-10-01), Jorne et al.
patent: 6136707 (2000-10-01), Cohen
patent: 6179983 (2001-01-01), Reid et al.
patent: 6193860 (2001-02-01), Weling
patent: 6197181 (2001-03-01), Chen
patent: 6297157 (2001-10-01), Lopatin et al.
patent: 6350366 (2002-02-01), Landau et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6402923 (2002-06-01), Mayer et al.
patent: 6497801 (2002-12-01), Woodruff et al.
patent: 6527920 (2003-03-01), Mayer et al.
patent: 6569299 (2003-05-01), Reid et al.
patent: 6755954 (2004-06-01), Mayer et al.
patent: 6773571 (2004-08-01), Mayer et al.
patent: 6783611 (2004-08-01), Yajima et al.
patent: 6800187 (2004-10-01), Reid et al.
patent: 7682498 (2010-03-01), Mayer et al.
patent: 2002/0195352 (2002-12-01), Mayer et al.
patent: 2003/0102210 (2003-06-01), Woodruff et al.
patent: 2004/0061919 (2004-04-01), Tench et al.
patent: 2004/0065540 (2004-04-01), Mayer et al.
patent: 2005/0006245 (2005-01-01), Sun et al.
patent: 2005/0009325 (2005-01-01), Chung et al.
patent: 2005/0173252 (2005-08-01), Chen
patent: 2006/0178007 (2006-08-01), Nakamura et al.
patent: 2006/0266655 (2006-11-01), Sun et al.
patent: 2009/0277867 (2009-11-01), Mayer et al.
patent: 2009/0280649 (2009-11-01), Mayer et al.
patent: 2010/0032304 (2010-02-01), Mayer et al.
patent: 0037325 (1981-03-01), None
patent: 59-162298 (1984-09-01), None
patent: 09-53197 (1997-02-01), None
patent: 2001316887 (2001-11-01), None
patent: WO/9941434 (1999-08-01), None
U.S. Appl. No. 11/179,984, Mayer et al.,Rotationally Asymmetric Variable Electrode Correction, filed Jul. 11, 2005, 51 pages.
Fang et al., “Uniform Copper Electroplating on Resistive Substrates,” Abs. 167, 205thMeeting, © 2004 The Electrochemical Society, Inc., 1 page.
Oliver Chyan et al. “Electrodeposition of Copper Thin Film on Ruthenium”, Journal of the Electochemical Society, 150 (5) pp. C347-C350 (2003).
Ken M. Takahashi “Electroplating Copper onto Resistive Barrier Films”, Journal of the Electrochemical Society, 147(4) 1414-1417 (2000).
T.P. Hoar and J. N. Agar “Factors in Throwing Power Illustrated by Potential-Current Diagrams”, Received Mar. 13, 1947.
“Damascene Cu Electroplating Chemistry”, Handbook of Semiconductor Manufacturing Technology, © 2008 by Taylor & Francis Group, LLC.
W.A. Fairweather, “The Throwing Power of Acid Copper Plating Processes for Printed Circuit Boards”, MS received May 10, 1983.
U.S. Office Action mailed Nov. 4, 2009 in U.S. Appl. No. 11/682,175.
U.S. Notice of Allowance and Allowed Claims mailed May 17, 2010 in U.S. Appl. No. 11/682,175.
Ponnuswamy et al., “Copper Electroplating Process For Uniform Across Wafer Deposition and Void Free Filling on Semi-Noble Metal Coated Wafers”, U.S. Appl. No. 12/785,205, filed May 21, 2010.

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