Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-07-24
2007-07-24
Malsawma, Lex (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
Reexamination Certificate
active
11047848
ABSTRACT:
A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic component; coupling the first surface of the electronic component to a first surface of a lower dielectric strip; coupling the second surface of the electronic component to a first surface of an upper dielectric strip; forming lower via apertures through the lower dielectric strip to expose second selected bond pads of the plurality of bond pads on the first surface of the electronic component; forming upper via apertures through the upper dielectric strip to expose the bonding locations on the second surface of the electronic component; filling the lower and upper via apertures with an electrically conductive material to form lower and upper vias electrically coupled to the first and second selected bond pads of the plurality of bond pads on the first surface of the electronic component.
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Hiner David
Huemoeller Ronald Patrick
Lie Russ
Amkor Technology Inc.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Malsawma Lex
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