Two-sided planar magnetron sputtering apparatus

Details Two-sided planar magnetron sputtering apparatus Two-sided planar magnetron sputtering apparatus

1977-12-08

1978-09-26

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1500

Patent

active

041168062

ABSTRACT:
Apparatus for depositing layers of materials onto substrates by magnetically enhanced cathodic sputtering; typically comprising an enclosure having atmospheric sealing means between the atmosphere inside and the atmosphere outside the enclosure, vacuum pump means connected to the enclosure to reduce the pressure inside relative to the atmospheric pressure outside the enclosure, a cathode within the enclosure comprising a frame of substantially symmetric shape about a centrally disposed centerplane, a plurality of magnets supported in the frame and positioned with the neutral axis of each magnet substantially in the centerplane, and at least one target plate supported on the frame on each side of the centerplane, insulation means between the frame and the enclosure, means for connecting an electrical potential difference between the frame and the enclosure, and means in and supported by the enclosure for supporting and conveying the substrates on opposite sides of, and parallel to, the target plates from a position on one side to a position on the other side of the cathode.

REFERENCES:
patent: 3852181 (1974-12-01), Cirkler et al.
patent: 3856654 (1974-12-01), George
patent: 3878085 (1975-04-01), Corbani
patent: 3890217 (1975-06-01), Burrows et al.
patent: 3945911 (1976-05-01), McKelvey
patent: 3956093 (1976-05-01), McLeod
patent: 4013532 (1977-03-01), Cormia et al.
patent: 4022947 (1977-05-01), Grubb et al.
patent: 4060470 (1977-11-01), Clarke

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