Two-sided chemical mechanical polishing pad for...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S539000, C451S526000

Reexamination Certificate

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06942549

ABSTRACT:
A chemical mechanical polishing (CMP) pad includes a unitary body having a first side and a second side, the first side having a plurality of holes formed therein, and the second side having a plurality of grooves formed therein. Each of the plurality of holes in the first side is aligned with one of the plurality of grooves in the second side.

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patent: 5725420 (1998-03-01), Torii
patent: 5876271 (1999-03-01), Oliver
patent: 5882251 (1999-03-01), Berman et al.
patent: 6120366 (2000-09-01), Lin et al.
patent: 6458023 (2002-10-01), Moon
patent: 6572446 (2003-06-01), Osterheld et al.
patent: 6623337 (2003-09-01), Scott et al.
patent: 6656019 (2003-12-01), Chen et al.
patent: 6685548 (2004-02-01), Chen et al.
patent: 6692338 (2004-02-01), Kirchner
patent: 2003/0034131 (2003-02-01), Park et al.
patent: 2002028849 (2002-01-01), None
patent: 2003334753 (2003-11-01), None
patent: WO 3017348 (2003-02-01), None

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