Two-sided chemical mechanical polishing pad for...

Details Two-sided chemical mechanical polishing pad for... Two-sided chemical mechanical polishing pad for...

2005-09-13

2005-09-13

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S539000, C451S526000

Reexamination Certificate

active

06942549

ABSTRACT:
A chemical mechanical polishing (CMP) pad includes a unitary body having a first side and a second side, the first side having a plurality of holes formed therein, and the second side having a plurality of grooves formed therein. Each of the plurality of holes in the first side is aligned with one of the plurality of grooves in the second side.

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patent: 2002028849 (2002-01-01), None
patent: 2003334753 (2003-11-01), None
patent: WO 3017348 (2003-02-01), None

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