Two position anneal chamber

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S269000

Reexamination Certificate

active

10823849

ABSTRACT:
Embodiments of the invention generally provide an annealing apparatus and method for a semiconductor processing platform. The annealing apparatus includes a plurality of isolated annealing chambers, wherein each of the annealing chambers has a heating plate positioned in a sealed processing volume, a cooling plate positioned in the processing volume, and a substrate transfer mechanism positioned in the processing volume and configured to transfer substrates between the heating plate and the cooling plate. The annealing system further includes a gas supply source selectively in communication with each of the individual annealing chambers.

REFERENCES:
patent: 3649509 (1972-03-01), Morawetz et al.
patent: 3727620 (1973-04-01), Orr
patent: 3770598 (1973-11-01), Creutz
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4092176 (1978-05-01), Kozai et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4113492 (1978-09-01), Sato et al.
patent: 4315059 (1982-02-01), Raistrick et al.
patent: 4326940 (1982-04-01), Eckles et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4376685 (1983-03-01), Watson
patent: 4405416 (1983-09-01), Raistrick et al.
patent: 4428815 (1984-01-01), Powell et al.
patent: 4435266 (1984-03-01), Johnston
patent: 4489740 (1984-12-01), Rattan et al.
patent: 4510176 (1985-04-01), Cuthbert et al.
patent: 4518678 (1985-05-01), Allen
patent: 4519846 (1985-05-01), Aigo
patent: 4568431 (1986-02-01), Polan
patent: 4693805 (1987-09-01), Quazi
patent: 4732785 (1988-03-01), Brewer
patent: 4789445 (1988-12-01), Goffman et al.
patent: 4816098 (1989-03-01), Davis et al.
patent: 5039381 (1991-08-01), Mullarkey
patent: 5055425 (1991-10-01), Leibovitz et al.
patent: 5069760 (1991-12-01), Tsukamoto et al.
patent: 5092975 (1992-03-01), Yamamura et al.
patent: 5100516 (1992-03-01), Nishimura et al.
patent: 5155336 (1992-10-01), Gronet et al.
patent: 5162260 (1992-11-01), Leibovitz et al.
patent: 5222310 (1993-06-01), Thompson et al.
patent: 5224504 (1993-07-01), Thompson et al.
patent: 5230743 (1993-07-01), Thompson et al.
patent: 5252807 (1993-10-01), Chizinsky
patent: 5256274 (1993-10-01), Poris
patent: 5259407 (1993-11-01), Tuchida et al.
patent: 5290361 (1994-03-01), Hayashida et al.
patent: 5292393 (1994-03-01), Maydan et al.
patent: 5316974 (1994-05-01), Crank
patent: 5324684 (1994-06-01), Kermani et al.
patent: 5328589 (1994-07-01), Martin
patent: 5349978 (1994-09-01), Sago et al.
patent: 5368711 (1994-11-01), Poris
patent: 5377425 (1995-01-01), Kawakami et al.
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5415890 (1995-05-01), Kloiber et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5431700 (1995-07-01), Sloan
patent: 5442235 (1995-08-01), Parrillo et al.
patent: 5447615 (1995-09-01), Ishida
patent: 5449447 (1995-09-01), Branders
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5527739 (1996-06-01), Parrillo et al.
patent: 5608943 (1997-03-01), Konishi et al.
patent: 5625170 (1997-04-01), Poris
patent: 5651865 (1997-07-01), Sellers
patent: 5677244 (1997-10-01), Venkatraman
patent: 5705223 (1998-01-01), Bunkofske
patent: 5716207 (1998-02-01), Mishina et al.
patent: 5718813 (1998-02-01), Drummond et al.
patent: 5723028 (1998-03-01), Poris
patent: 5820692 (1998-10-01), Baecker et al.
patent: 5884009 (1999-03-01), Okase
patent: 5994675 (1999-11-01), Bethune et al.
patent: 6015749 (2000-01-01), Liu et al.
patent: 6071388 (2000-06-01), Uzoh
patent: 6072163 (2000-06-01), Armstrong et al.
patent: 6093291 (2000-07-01), Izumi et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6187152 (2001-02-01), Ting et al.
patent: 6203582 (2001-03-01), Berner et al.
patent: 6207005 (2001-03-01), Henley et al.
patent: 6207937 (2001-03-01), Stoddard et al.
patent: 6211945 (2001-04-01), Baxter et al.
patent: 6222164 (2001-04-01), Stoddard et al.
patent: 6242349 (2001-06-01), Nogami et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6267853 (2001-07-01), Dordi et al.
patent: 6276072 (2001-08-01), Morad et al.
patent: 6290833 (2001-09-01), Chen
patent: 6290865 (2001-09-01), Lloyd et al.
patent: 6290933 (2001-09-01), Durga et al.
patent: 6294059 (2001-09-01), Hongo et al.
patent: 6296906 (2001-10-01), Stimmell et al.
patent: 6307184 (2001-10-01), Womack et al.
patent: 6309520 (2001-10-01), Woodruff et al.
patent: 6368966 (2002-04-01), Krishnamoorthy et al.
patent: 6423947 (2002-07-01), Womack et al.
patent: 6428673 (2002-08-01), Ritzdorf et al.
patent: 6440178 (2002-08-01), Berner et al.
patent: 6483081 (2002-11-01), Batchelder
patent: 6508920 (2003-01-01), Ritzdorf et al.
patent: 6529686 (2003-03-01), Ramanan et al.
patent: 6544338 (2003-04-01), Batchelder et al.
patent: 6639189 (2003-10-01), Ramanan et al.
patent: 6740196 (2004-05-01), Lee et al.
patent: 2001/0030101 (2001-10-01), Berner et al.
patent: 2002/0000271 (2002-01-01), Ritzdorf et al.
patent: 2002/0022363 (2002-02-01), Ritzdorf et al.
patent: 2002/0029961 (2002-03-01), Dordi et al.
patent: 2002/0037641 (2002-03-01), Ritzdorf et al.
patent: 2002/0074233 (2002-06-01), Ritzdorf et al.
patent: 2003/0045095 (2003-03-01), Ritzdorf et al.
patent: 2004/0016637 (2004-01-01), Yang et al.
patent: 0 421 735 (1991-04-01), None
patent: 0 881 673 (1998-12-01), None
patent: 1 037 263 (2000-09-01), None
patent: 1 085 557 (2001-03-01), None
patent: 54-148112 (1979-11-01), None
patent: 58-182823 (1983-10-01), None
patent: 63-118093 (1988-05-01), None
patent: 4-131395 (1992-05-01), None
patent: 4-280993 (1992-10-01), None
patent: 6-17291 (1994-01-01), None
patent: WO 93/17448 (1993-09-01), None
patent: WO 97/12079 (1997-04-01), None
patent: WO 99/40615 (1999-08-01), None
Colombo, “Wafer Back Surface Film Removal”0, Central R&D, SGS-Thomson Microelectronics, Agrate, Italy, Spin Tech Technology, 6 pages, unknown date.
Holm, Electric Contacts Theory and Application, Fourth Completely Rewritten Edition, Springer-Verlag, New York Inc., Aug. 21, 1967, 27 pages.
Jiang, et al., “Variations in Cu CMP Removal Rate Due to Cu Film Self-Annealing”, Advanced Metallization Conference in 1998 (AMC 1998), 8 pages.
Pitney, “NEY Contact Manual”, Electric Contacts for Low Energy Uses, 1973.
Simpson, et al., “The Electrical Integrity of Copper Plated Wafers Using a Novel Plating Bath Chemistry” Slides Publicly Disclosed, 13 Pages Oct. 17-22, 1999.
Singer, “Tantalum, Copper and Damascene: The Future of Interconnects,” Semiconductor International, Jun. 1998, Pages cover, pp. 91-94, 96, & 98.
Singer, “Wafer Processing”, Semiconductor International, Jun. 1998, p. 70.
Laurel Technologies Corporation from www.laurell.com, “Two control configurations available- seeWS 400 OR WS-400Lite.” 1998, 6 pages.
Welcome to Verteq Online Products Overview, from Verteq from www.verteq.com, unknown date.
“Metallization & Interconnect”, Semitool, Inc., 1998, 4 pages.
European Search Report from EP 0 110 3525 dated Jul. 10. 2001.
European Search Report for Application 301415.6 dated Dec. 11, 2000.
Austrian Patent Office Search report for Application 00010504, unknown date.

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