Two-layer solderable gold for thick film circuits

Details Two-layer solderable gold for thick film circuits Two-layer solderable gold for thick film circuits

1995-11-13

1997-10-14

Jordan, Charles T.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

252514, 106 113, 419 8, B22F 300

Patent

active

056781687

ABSTRACT:
A system of two thick film pastes containing gold, in which the first paste is deposited directly onto a substrate, and the second is deposited directly onto the first, contain Cr.sub.2 O.sub.3 and Bi.sub.2 O.sub.3, which enhance the adhesion to the substrate of the first deposited paste and the solderability of the second deposited paste.

REFERENCES:
patent: 4170126 (1979-10-01), Craven
patent: 4546283 (1985-10-01), Adamo et al.
patent: 4777098 (1988-10-01), Takamura et al.

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