Twin NAND device structure, array operations and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S296000, C257S324000

Reexamination Certificate

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06998658

ABSTRACT:
A method for making a twin MONOS memory array is described where two nitride storage sites lay under the memory cell word gate. The fabrication techniques incorporate self alignment techniques to produce a small cell in which N+ diffusion the nitride storage sites are defined by sidewalls. The memory cell is used in an NAND array where the memory operations are controlled by voltages on the word lines and column selectors. Each storage site within the memory cell is separately programmed and read by application of voltages to the selected cell through the selected word line whereas the unselected word lines are used to pass drain and source voltages to the selected cell from upper and lower column voltages.

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F. Masuoka et al., “A New NAND Cell for Ultra High Density 5V-Only EEPROMS,” May 1988, Proc. 1988 Symp. on VLSI Tech, IV-5, pp. 33-34.

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