Tungsten plug corrosion prevention method using water

Details Tungsten plug corrosion prevention method using water Tungsten plug corrosion prevention method using water

2007-08-07

2007-08-07

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S624000, C438S625000, C438S627000, C438S629000, C438S642000, C438S643000, C438S648000, C438S652000, C438S653000, C438S656000, C438S669000, C438S670000, C438S671000, C438S672000, C438S675000, C438S677000, C438S685000, C257SE21168, C257SE21185, C257SE21187, C257SE21189, C257SE21218

Reexamination Certificate

active

10602291

ABSTRACT:
Disclosed herein is a method of making integrated circuits. In one embodiment the method includes forming tungsten plugs in the integrated circuit and forming electrically conductive interconnect lines in the integrated circuit after formation of the tungsten plugs. At least one tungsten plug is electrically connected to at least one electrically conductive interconnect line. Thereafter at least one electrically conductive interconnect line is contacted with water for a period of time less than 120 minutes.

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